EuroSimE 2025: Submit your abstract now!
The 26th EuroSimE Conference seeks original, noncommercial papers describing research and innovations related to results of fundamental research and industrial applications for thermal, mechanical, and multiphysics simulation and experiments of micro/nano-electronics and microsystems. Authors are invited to submit an abstract describing recent work. Abstracts must detail the objectives of the work presented and demonstrate new results.
Accepted papers will be submitted for inclusion in the IEEE Xplore digital library. The best papers will be selected for publication in Elsevier Microelectronics Reliability Journal and MDPI Micromachines Journal. Preselection of best papers candidates will be based upon abstracts that are expected to clearly highlight scope, approach and major results of the proposed contributions.
Topics
Single domain simulation
- Thermal, mechanical, thermo-mechanical, vibration, shock
- Chip package board interaction
- Advanced numerical and analytical simulations methodologies and tools
- Compact Modelling & Model Order Reduction
- Digital twins
- Advanced thermal management concepts
Material characterization and validation
- Material characterization, experiments and modelling
- Bulk and interface toughness, characterization and modeling
- Experimental methods for validation of simulation models
- Failure analysis and failure mode extraction
- Failure criteria and damage modelling for reliability prediction
Application domains
- Electronic components, packaging and system integration for applications including aerospace, automotive, energy, lighting
and medical. - MEMS sensors & actuators, piezoelectric, piezoresistive, functional ceramic sensors and components
- Opto-electronic & opto-mechanical devices
- Nano-electronic mechanical devices
- Consumer electronics
Multi-physics simulation
- Multi-physics simulation (MEMS, manufacturing and process models, electronic control unit/system level, fluid structure
interactions) - Multi-scale modelling and simulation
- Integrated process modelling
- Simulation-based optimization, virtual prototyping and prequalification in product and process design
- Simulations for heterogeneous integration
Emerging modeling methods and tools
- Prognostics and Health Management (PHM)
- Development and implementation of artificial intelligence and machine learning
- Use of big data in simulation & reliability applications
- 3D packaging, TSV technology, heterogenuous integraton, chiplet packaging
- Additive manufacturing (3D printing) for electronics
Abstract Submission
Please use the provided template for your abstract and upload it to the online conference system at https://www.conftool.org/eurosime2025
Important Dates
Deadline abstract submission: Extended to November 22, 2024
Notification of acceptance: December 20, 2024
Submission of full paper for proceedings: February 28, 2025