25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

 

On March 14, 175 attendants are registered.

See final programme

See programme of short courses

 

2024 sponsors and exhibitors

Exhibitor manual and Sponsorship brochure

Best papers are selected for publishing in two Elsevier Journals: Microelectronics Reliability and Mechatronics, plus one open access journal: MDPI Micromachines.

Microelectronics Reliability: special issue for EuroSime 2018

Technical sponsorship from IEEE Electronics Packaging Society
banner eurosime 2024