25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
On March 14, 175 attendants are registered.
See final programme
See programme of short courses
2024 sponsors and exhibitors
Exhibitor manual and Sponsorship brochure
Best papers are selected for publishing in two Elsevier Journals: Microelectronics Reliability and Mechatronics, plus one open access journal: MDPI Micromachines.
Microelectronics Reliability: special issue for EuroSime 2018
Technical sponsorship from